Hexafluoroethane
六氟乙烷(C2F6)，又稱全氟乙烷，是一種無色、無味、不可燃的惰性氣體。六氟乙烷熔點為-100.6℃，沸點為-78.2℃，微溶于水。六氟乙烷作為干腐蝕劑具有邊緣側向侵蝕現象極微、高蝕刻率及高精確性的優點，可以極好地滿足線寬較小的制程要求，被廣泛應用于半導體制作過程中。
Hexafluoroethane (C2F6), also known as perfluoroethane, is a kind of colorless, odorless, non-flammable inert gas. Its melting point is 100.6 ℃, boiling point is 78.2 ℃, slightly soluble in water. Due to its non-toxic, odorless and high stability, hexafluoroethane is widely used in the semiconductor manufacturing process. Hexafluoroethane, as a dry etchant, has the advantages of very small edge-side etching, high etching rate and high accuracy, which can meet the requirements of semiconductor manufacturing process for small linewidth.
| 項目 Items | 單位 Unit | 指標 Indexs |
| C2F6 | Vol.% | ≥99.999 |
| O2+Ar | Vol.ppm | ＜1 |
| N2 | Vol.ppm | ＜5 |
| CO | Vol.ppm | ＜0.5 |
| CO2 | Vol.ppm | ＜0.5 |
| H2 | Vol.ppm | ＜0.5 |
| 鹵代烴 Halohydrocarbon | Vol.ppm | ＜5 |
| CH4 | Vol.ppm | ＜1 |
| H2O | Vol.ppm | ＜2 |
| 酸度Acidity（Measured by HF） | Wt. ppm | ＜0.1 |
| 總雜質含量Total impurity content | Mol.ppm | ≤10 |
電子級高純六氟乙烷主要在半導體器件制造過程中，作為蝕刻劑、化學氣相沉積（CVD）后的腔體清洗劑等使用，同時也可作為高介電強度制冷劑和電氣設備的氣體絕緣介質使用。
Electronic grade hexafluoroethane is mainly used in the manufacturing process of semiconductor materials and semiconductor devices as etching agent and cleaning agent, as well as insulation gas and high dielectric strength coolant.
六氟乙烷充裝在經特殊處理的潔凈、干燥的無縫高壓氣瓶中，氣瓶容積分別為4L、8L、10L、12.5L、40L等。具體包裝規格可根據用戶需求定制更改。
Hexafluoroethane is filled in clean and dry seamless cylinders with special treatment. The cylinder volumes are 4L, 8L, 10L, 12.5L and 40L etc. Packaging specifications can be customized according to customers' requirements.
